https://doi.org/10.1140/epjd/s10053-021-00200-w
Regular Article - Plasma Physics
Contribution of inter- and intraband transitions into electron–phonon coupling in metals
1
Institute of Physics, Czech Academy of Sciences, Na Slovance 2, 18221, Prague 8, Czech Republic
2
Institute of Plasma Physics, Czech Academy of Sciences, Za Slovankou 3, 182 00, Prague 8, Czech Republic
3
Industrial Focus Group XUV Optics, MESA+ Institute for Nanotechnology, University of Twente, Drienerlolaan 5, 7522 NB, Enschede, The Netherlands
Received:
16
March
2021
Accepted:
14
June
2021
Published online:
23
July
2021
We recently developed an approach for calculation of the electron–phonon (electron–ion in a more general case) coupling in materials based on tight-binding molecular dynamics simulations. In the present work, we utilize this approach to study partial contributions of inter- and intraband electron scattering events into total electron–phonon coupling in Al, Au, and Cu elemental metals and in AlCu alloy. We demonstrate that the interband scattering plays an important role in the electron–ion energy exchange process in Al and AlCu, whereas intraband d–d transitions are dominant in Au and Cu. Moreover, inter- and intraband transitions exhibit qualitatively different dependencies on the electron temperature. Our findings should be taken into account for the interpretation of experimental results on the electron–phonon coupling parameter.
This work benefited from networking activities carried out within the EU funded COST Action CA17126 (TUMIEE) and represents a contribution to it. The authors gratefully acknowledge financial support from the Czech Ministry of Education, Youth and Sports (Grants Nos. LTT17015, EF16_013/0001552, and LM2015083). I. Milov gratefully acknowledges support from the Industrial Focus Group XUV Optics of the MESA+ Institute for Nanotechnology of the University of Twente; the industrial partners ASML, Carl Zeiss SMT GmbH, and Malvern PANalytical, and the Netherlands Organisation for Scientific Research (NWO).
© The Author(s) 2021
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