https://doi.org/10.1007/s100530170122
Coalescence process of monodispersed Co cluster assemblies
1
CREST of Japan Science and Technology Corporation, Kawaguchi 332-0012, Japan
2
Department of Materials Science and Engineering, Nagoya Institute of Technology, Nagoya 466-8555, Japan
3
Institute for Materials Research, Tohoku University, Sendai 980-8577, Japan
Corresponding author: a pengdl@mse.nitech.ac.jp
Received:
29
November
2000
Published online: 15 September 2001
Cluster-cluster coalescence process of monodispersed Co clusters with mean diameter d = 8.5 and 13
nm deposited a plasma-gas-condensation-type cluster beam deposition system was investigated by
in situ electrical conductivity measurements and ex situ scanning electron
microscopy (SEM) and transmission electron microscopy (TEM), and analyzed by percolation concept. The
electrical conductivity measurement and TEM observation indicated that, below temperature T
C, the Co clusters in the assemblies maintain their original structure as deposited
at room temperature, while that the inter-cluster coalescence takes place at 
C,
although the size distribution and the interface morphology of the clusters showed no marked change at
substrate temperatures 
C.
PACS: 61.46.+w – Nanoscale materials: clusters, nanoparticles, nanotubes, and nanocrystals / 73.40.-c – Electronic transport in interface structures / 61.16.Bg – Transmission, reflection, and scanning electron microscopy
© EDP Sciences, Società Italiana di Fisica, Springer-Verlag, 2001
